K-WANG
AMAT/Applied Materials 0041-75950 Reactor
Part Number:0041 - 75950
Product Type: Chemical Vapor Deposition (CVD)
AMAT 0041-75950 is a chemical vapor deposition (CVD) reactor designed specifically for thin film deposition, capable of temperature controlled heating or cooling. It is mainly used to deposit conformal and uniform thin films on various substrates. The reactor consists of a reaction chamber sealed inside a vacuum container, which enables precise thermal control and efficient material transfer.
Key parameters
Temperature range: The working temperature range is from room temperature to 1000 ° C, which enables it to deposit various thin film materials and adapt to the temperature requirements of different processes.
Sedimentary materials: There are abundant thin film materials that can be deposited, including silicon nitride, silicon dioxide, aluminum nitride, etc. These materials have a wide range of applications in industries such as semiconductors and optoelectronics. For example, silicon nitride thin films have good chemical stability and insulation properties, and are commonly used as passivation layers in semiconductor devices; Silicon dioxide thin film can be used as an insulating medium in integrated circuit manufacturing; Aluminum nitride film has high thermal conductivity and good electrical insulation, making it suitable for heat dissipation in power devices.
Structural and functional design
Temperature control chamber: The reaction chamber is designed for precise thermal control, while also having heating and cooling functions to achieve optimal thin film deposition results. Accurate temperature control is crucial for the quality and performance of thin films, ensuring that key indicators such as uniformity and crystallinity meet the requirements.
Gas control system: During the deposition process, the gas control unit delivers precise amounts of gas to the reaction chamber, ensuring precise control of the film quality. Different thin film deposition processes require different types and flow rates of gases. This system can accurately adjust the gas supply according to preset parameters to ensure that the chemical composition and structure of the thin film meet expectations.
Sedimentary source: The sedimentary source provides a controllable material supply to the reaction chamber, where the material is deposited onto the substrate. By precisely controlling the output of the deposition source, the growth rate and thickness uniformity of the thin film can be controlled.
Multi functional heating sensor: The reactor is equipped with magnetic sensors for heating or cooling, which can use various heating methods such as electron bombardment and induction heating. These heating methods can be selected according to different process requirements, providing greater process flexibility.
Multiple material compatibility: This reactor is designed for depositing thin films on a wide range of substrates, including silicon, sapphire, quartz, and glass. Different substrate materials have different physical and chemical properties, and this reactor can adapt to these differences to achieve high-quality thin film deposition.
Operational and application advantages
User friendly design: The reactor has an intuitive computer interface and provides both automation and manual operation options, making it convenient for users to choose according to their actual needs. Both experienced engineers and novice operators can quickly get started and improve work efficiency.
Precise control: It can precisely control temperature, gas flow rate, and deposition rate, making it very suitable for a wide range of applications in industries such as semiconductors, optoelectronics, and optomechanics. Accurate process control is the key to achieving high-performance chip manufacturing in semiconductor manufacturing; In the field of optoelectronics, precise control of optical thin films can improve the performance of optoelectronic devices.
Durable mechanical design: The use of durable materials and sturdy mechanical design ensures the safe and reliable operation of the equipment. In industrial production environments, equipment needs to operate stably for a long time, and the design of this reactor can meet this requirement, reducing equipment failures and maintenance costs.