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ADLINK DLAP-5200 series high-performance fanless AI industrial computer

From: | Author:Wang | Time :2026-07-14 | 3 visit: | 🔊 Click to read aloud ❚❚ | Share:


ADLINK DLAP-5200 series high-performance fanless AI industrial computer

Basic Information

Linghua DLAP-5200 series industrial AI host product specification manual, positioned as * * fanless compact AI computing embedded platform * *, focusing on machine vision, automated detection, and edge AI inference scenarios. The whole machine has a closed fanless structure and can operate 24/7 for a long time. It supports MXM independent GPU expansion for multi screen output and is suitable for dust and wide temperature industrial sites.


Product core positioning and core features

Core Positioning

A high-performance fanless industrial host for high-end automation, machine vision, and edge AI, equipped with 12/13/14 generation Core processors, supporting MXM industrial discrete graphics, multiple 2.5G industrial networks, multi screen output, -20 ℃ low-temperature startup, and no cooling fan throughout the body, suitable for dusty industrial environments.

Core Highlights

1. Fanless silent and sealed machine, supporting 7 × 24-hour uninterrupted operation, dustproof and resistant to harsh working conditions;

2. Supports 12/13/14 generation Intel Core E/TE industrial low-power processors, with a maximum of 24 cores;

3. Equipped with MXM 3.1 Type A/B discrete graphics module and NVIDIA A4500/A2000 industrial GPU, it meets AI inference and graphics rendering needs;

4. Extra large memory expansion: 4 DDR5 4800 SO-DIMM slots, maximum 196GB;

5. Dual model differentiated display output: 3DP version, 6DP version, multiple HDMI+DP screens;

6. Multiple TSN industrial 2.5GbE network ports, multiple serial ports supporting RS232/422/485;

7. Wide voltage 12/24VDC DC power supply, wide temperature operation, strong seismic and impact resistance industrial grade;

8. Pre installed Windows 10/11 IoT Enterprise Edition, Ubuntu 22.04 industrial operating system, and onboard TPM 2.0 security chip.

Hardware core specification parameters

1. Computing platform

-Chipset: R680E

-CPU compatibility list

12th generation Alder Lake E/TE (35W low-power/65W standard version): i9/i7/i5/i3;

13th generation Raptor Lake E/TE;

14th generation Raptor Refresh i9/i7/i5/i4 standard processor;

The power consumption is divided into two levels: 35W (wide temperature range -20~50 ℃) and 65W (-20~40 ℃).

-Memory: 4xDDR5 4800 SO-DIMM, maximum 196GB

-Graphics Expansion: MXM 3.1 A/B slots, supporting NVIDIA Ampere architecture A4500, A2000, ADA2000 industrial GPUs

-Security onboard TPM 2.0 encryption module

2. Storage configuration

1. Two SATA III 6Gbps interfaces, supporting 2.5-inch SSDs;

2. M.2 expansion dual slots: M Key 2280 (NVMe solid-state drive), E Key 2230 (wireless/4G network card);

The whole machine supports NVMe+SATA hybrid storage solution, with a maximum capacity of 4TB and optional solid-state configuration.

3. Dual model I/O interface differentiation

DLAP-5200-3DP (3-channel DP version)

-Display: 2 x HDMI 1.4b+3 x DP 1.4 (including 1 channel from MXM graphics card)

-Network port: 6-way 2.5GbE i225 network card, supporting TSN time sensitive network

-Serial port: 2-channel switchable RS232/422/485

- USB:4×USB3.2 Gen2 + 2×USB3.1 Gen2

DLAP-5200-6DP (6-channel multi screen version)

-Display: 2 x HDMI 1.4b+6 x DP 1.4 (4 channels from MXM graphics card, dedicated for multi screen visual inspection)

-Network port: 3-channel 2.5GbE i225 TSN network card

-Serial port: 2 RS232/422/485+1 pure RS232

-USB: Same as 3DP model (4xUSB3.2+2xUSB3.1)

General indicator light

Storage status, watchdog WDT, diagnostic light, and 3-channel custom user indicator light.

4. Machinery, Power Supply, and Environment

1. Size and weight: 125 (W) × 240 (D) × 210 (mm), total weight 6.8kg, supports wall mounted installation;

2. Power supply: 2-pin Phoenix terminal 12/24VDC DC input, optional 280W AC-DC power adapter;

3. Temperature

-35W low-power CPU: operating at -20 ℃~50 ℃

-65W standard CPU: Operating at -20 ℃~40 ℃

-Storage: -40 ℃~85 ℃

4. Environmental reliability

-Humidity: up to 95% @ 40 ℃, no condensation;

-Vibration (with SSD operation): 3Grms, 5~500Hz three-axis random;

-Shock: 30G, 11ms half sine wave;

-ESD static electricity: contact ± 4KV, air ± 8KV;

-Certification: CE, FCC Class A industrial electromagnetic compatibility, UL/CB safety certification.


Model Selection Comparison Table

5 mainstream customized models, distinguishing CPU, memory, storage, MXM graphics card, display/Ethernet/serial port configurations:

|Model | CPU | Memory | Storage | MXM Graphics Card | Display | Network Port | Serial Port|

| DLAP-5209RF | i9-14000 | 32GB | 1TB NVMe+4TB SATA | A4500 | 3DP+2HDMI | 6×2.5G | 2COM |

| DLAP-5207 | i7-12700E | 64GB | 2×2TB SSD | A2000 | 3DP+2HDMI | 6×2.5G | 2COM |

|DLAP-5207 Bare Machine | i7-12700E | 32GB | No Disk | No Unique Display | 3DP+2HDMI | 6 × 2.5G | 2COM|

| DLAP-5209R | i9-13900E | 32GB | 512GB SSD | A2000 | 6DP+2HDMI | 3×2.5G | 3COM |

|DLAP-5207R Bare Machine | i7-13700E | 32GB | No Disk | No Unique Display | 6DP+2HHDMI | 3 × 2.5G | 3COM|


Supporting accessories, system software

1. Standard factory accessories

Wall mounted bracket, 2-pin power terminal block.

2. Optional accessories

280W industrial AC/DC power adapter (part number 31-62162-1010-A0).

3. Pre installed industrial operating system (with corresponding part number)

1. Windows 10 IoT Enterprise LTSC 2021: Three sets of licenses for high-end, standard, and entry-level versions;

2. Windows 11 IoT Enterprise 2022: Three sets of licenses for high-end, standard, and entry-level versions;

3. Native support for Ubuntu 22.04 Linux system, compatible with AI development environment.

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