K-WANG



Core computing system (CPU, chipset, memory, etc.) BIOS、 Safety)
1. Processor
Adopting Intel Atom N270 BGA package, with a main frequency of 1.6GHz, 512KB secondary cache, and a processor power consumption of only 2.5W;
Built in 32KB instruction cache+24KB write back data cache;
Supports hyper threading (dual threading) and Intel SpeedStep energy-saving technology;
Supports C0~C4 multi-level low-power sleep mode, paired with AGTL+bus driver, synchronized double/quadruple address/data bus, with outstanding low-power advantages.
2. Chipset North South Bridge Combination
North Bridge: Intel 945GSE GMCH integrated graphics storage controller;
South Bridge: Intel ICH7-M Mobile I/O Controller.
3. Memory scheme
Single SODIMM slot, divided into two memory forms:
Standard DDR2: Maximum 2GB 533MHz without ECC or buffer memory;
Optional SSDDR (SD suffix models only): Virtium all-in-one module, integrated with DDR2 memory and SATA SSD, with specifications of 1GB DDR2 with 4-16GB SSD/2GB DDR2 with 4-16GB SSD.
4. BIOS and hardware monitoring
BIOS: AMI BIOS8, 8Mbit SPI flash storage with CMOS backup;
Hardware monitoring: Real time collection of power supply voltage and CPU temperature;
Watchdog Timer: Programmable timer for overflow reset of the entire machine.
5. Secure Encryption TPM
Equipped with Infineon SLB9635TT1.2 chip and TPM 1.2 secure encryption module, it meets the data encryption requirements of industrial equipment.
Bus and peripheral expansion interface
1. High speed expansion bus
PCI: 32-bit PCI 2.3 33MHz, supporting 4-channel bus master devices;
Fast ISA 16 bit: Expanded through PCI/ISA bridge IT8888G;
SMBus, I2C low-speed control bus.
2. Storage interface
IDE (PATA): Dual channel UDMA33;
SATA: Standard model with 2 channels of 1.5Gb/s; The SD model with SSDDR only has one SATA port.
3. Graphic display (dual independent display output)
945GSE integrated graphics core, multiple output interfaces:
VGA simulation: maximum resolution of 2048 × 1536;
LVDS: single/dual channel, supports 18bit/24bit, paired with Chronotel 7308B SDVO chip;
TV out: Supports NTSC/PAL standards SDTV/HDTV, No Macrovision copyright encryption.
4. Audio
ICH7-M has a built-in audio controller, paired with Realtek ALC262 HDA high-definition audio codec.
5. Network
PCIe x1 Realtek RTL8111C, 10/100Mbps adaptive Ethernet.
6. USB
4-channel USB 2.0 full speed port.
7. Super I/O (W83627HG chip, traditional industrial control interface)
2-channel high-speed RS232 serial port COM1/COM2;
SIR 1.1 infrared IrDA;
Parallel LPT: Supports SPP/EPP/ECP, with pins multiplexed with floppy drive FDD;
1-channel floppy drive FDD;
1 PS/2 keyboard and 1 PS/2 mouse.

Power specifications
Power supply mode: compatible with AT (only 5V), ATX (5V+5V standby 5VSb);
Power status: fully supports S0/S1/S3/S4/S5 PDCP sleep mode;
Typical power consumption: Equipped with N270+1GB memory, the machine has a typical power consumption of 9W and is compatible with fanless passive cooling design.
Mechanical, Environmental, and Reliability
Appearance standard: ETX rev3.02, size 95mm × 114mm;
Temperature: Storage -20 ℃~80 ℃;
Humidity: 5%~95% RH, no condensation;
Impact resistance (non working): 15G peak, 11ms;
Vibration:
Working state: 0.5Grms, 5~500Hz full axis;
Storage/transportation: 1.88Grms, 5-500Hz full axis;
Certification: CE, FCC electromagnetic compatibility certification.
Operating system support
Standard native support
Windows XP 32-bit, Windows Vista 32-bit, Linux 2.6. x kernel.
Expand BSP development package
Embedded XP BSP;
WinCE 6.0 BSP;
Linux 2.6.x BSP;
AIDI library: compatible with Win32, WinCE, Linux, used for upper layer application development.
Model ordering system (4 standard modules)
All equipped with N270 1.6GHz processor, the difference lies in LVDS bit depth and SSDDR solid-state memory:
ETX-AT-N270-18:18bit LVDS, No SSDDR;
ETX-AT-N270:24bit LVDS, No SSDDR;
ETX-AT-N270-18SD: 18 bit LVDS+SSDDR integrated solid-state memory support;
ETX-AT-N270-SD: 24bit LVDS+supports SSDDR integrated solid-state memory.
Supporting heat dissipation accessories
HTS-EAT-B: Uniform heat dissipation fins with threaded supports;
THS-EAT-B: Low profile passive heat sink (BGA CPU specific).
Hardware architecture diagram description
The built-in functional block diagram in the document clearly displays the chip interconnection logic:
The N270 CPU is directly connected to the 945GSE Northbridge, which controls DDR2 memory, graphics output (VGA/LVDS/TV out), and PCIe bus;
North Bridge and ICH7-M South Bridge are interconnected, with South Bridge responsible for SATA, PATA, USB, audio, SPI BIOS, LPC low-speed bus;
LPC bus extension W83627HG Super I/O (serial/parallel/keyboard and mouse), TPM security chip;
PCI bus leads to PCI/ISA bridge and gigabit network port;
The module outputs all peripheral signals externally through four sets of standard ETX connectors X1/X2/X3/X4.
Product positioning and application scenarios
This module is an entry-level low-power ETX industrial control core, suitable for enclosed fanless devices with extremely low power consumption. Typical applications include industrial automation, medical imaging equipment, gaming machines, POS cash terminals, measurement and detection equipment, and embedded human-machine interface HMI.

K-JIANG
Add: Jimei North Road, Jimei District, Xiamen, Fujian, China
Tell:+86-15305925923