Hine Automation Constellation series vacuum wafer transfer system

Hine Automation Constellation series vacuum wafer transfer system

Product positioning

Brand: Hine Automation

Series: Constellation Systems

Type: Cassette To Cassette Vacuum Wafer Transfer System

Application: Semiconductor, solar energy, panel industry, aimed at OEM equipment integration

Universal core features across the entire series

Reliability: MCBF>3000000 times, MTTR<2 hours

Wafer specification: Supports up to 200mm (SEMI standard)

Automation functions: wafer mapping, cross slot detection, safety interlock

Environmental compatibility: high vacuum, temperature resistance * * ≤ 100 ℃**

Communication interface: RS-232+Ethernet

Compliance certification: SEMI S2, CE

Structural design: compact volume, modular, customizable

Core configuration of each model

Model, structural plane, number, crystal circle box, load port, standard configuration of mechanical arm matching device

HA-200 4 sides 1 HA-3.0 HA-71A (optional)

HA-400 4 sides 1 HA-5.0 HA-75

HA-500 5 sides 1~2 HA-5.0 HA-75

HA-600 6-side 1~2 HA-5.0 HA-75

HA-800 8 sides 1-2 HA-5.0 HA-75

Key technical parameters

Transmission height: 1100mm

Vacuum pressure: ＜ 5.00 × 10 ⁻⁷ Torr

Leakage rate: 5.00 × 10 ⁻⁹ sccm He/sec

Power supply: 208 VAC, 20A, single-phase

Contact materials: 6061-T6 aluminum, 300/400 stainless steel Viton、 borosilicate glass

Interface standard: 200mm MESC

Optional accessories

Optical/mechanical aligner

SEMI Standard/Customized End effectors

Single/Double End effectors

25/50 wafer round box

Box isolation pipeline, slit valve

Company Profile

Hine Automation is a manufacturer of automation systems and robot component design

Serve OEM customers in industries such as semiconductors, solar energy, and flat panel displays

Advantages: high reliability, low cost, fast response, customizable design

Key issues

Question: What are the core differences among the models in the Constellation series? What application scale are they targeting? Answer: The core difference lies in the number of structural sides and the number of load ports in the wafer box: HA-200/400 has 4 sides and 1 load port, which is an entry-level/basic solution; HA-500 has 5 sides and 2 load ports; HA-600 has 6 sides and 2 load ports; HA-800 has 8 faces and 2 load ports. The more faces there are, the more expandable the process stations are, making it suitable for higher integration production lines.

Question: What are the vacuum performance indicators of this series of vacuum transmission systems? What vacuum level can be achieved? 

Answer: The basic working pressure is less than 5.00 × 10 ⁻⁷ Torr, with a leakage rate of 5.00 × 10 ⁻⁹ SCC He/sec, which belongs to the high vacuum level and meets the requirements of semiconductor wafer process for vacuum environment.

Question: Why is this device suitable for use by semiconductor OEM manufacturers? What are the core advantages reflected in? 

Answer: Advantages include:>3 million MCBFs, high reliability, and reduced downtime costs; Equipped with advanced features such as wafer mapping and cross slot detection, reducing OEM development workload; Compact size saves space; Standardization+customizable, balancing universality and specificity; SEMI S2/CE certification shortens the compliance cycle.