K-WANG
Bently Nevada 3500 Monitoring System Rack Installation and Maintenance
Receiving and Processing Instructions
Receiving inspection
Visually inspect the system for any obvious transportation damage. If there is any damage, file a claim with the carrier and submit a copy to Bently Nevada, LLC.
Handling and storage precautions
The circuit board is susceptible to static damage and requires the use of a grounding strap (such as 3M Velostat) before operation ® No.2060) Grounding: Avoid using tools/materials that are prone to static electricity, such as ungrounded soldering irons and non-conductive plastics.
Transport and storage of circuit boards require the use of conductive bags or foil, and special attention should be paid to static electricity accumulation in dry weather (humidity<30%).
When the system loses power, it will lose its mechanical protection function; When operating correctly, the module can be plugged in and out while powered on (see Chapter 4 for details).
Basic Information
System Overview
The 3500 monitoring system is used to continuously monitor the status of rotating and reciprocating machinery (such as imbalance, misalignment, shaft cracks, bearing failures, etc.) to improve factory safety, product quality, equipment availability, and reduce operating costs.
Core advantage: Enhanced operator information (providing multi-dimensional data, Windows) ® Basic display software, better integration of factory control computers (multi protocol communication gateway, time synchronization data), reduced installation and maintenance costs (reduced wiring, backward compatibility, easy configuration), improved reliability (redundant power supply, TMR system), intrinsic safety options, multiple output interfaces (supporting multiple display and control systems).
General characteristics
Hot swappable module: When operated correctly, any module can be plugged in and out while the system is powered on, without affecting the operation of unrelated modules (plugging in and out of the power supply does not interrupt the system when dual power is available).
Internal and external terminals: External terminals are connected to I/O modules and terminal blocks through multi-core cables (suitable for narrow space areas); Internal terminals allow sensors to be directly connected to I/O modules (I/O modules with internal Zener barriers have no external terminals).
System components
Including a weatherproof enclosure (protecting the rack from moisture and dust), rack (full-size 19 inch/compact 12 inch Mini rack), power supply (half height module, supporting 1-2 redundant installations), Rack Interface Module (RIM, communicating with the host and other modules, maintaining event lists), communication gateway module (allowing external devices to access information), monitoring module (collecting sensor data), relay module (controlling relays based on channel status) Keyphasor ® Modules (supplying power to sensors and processing signals), display modules (supporting multiple display devices), grounding modules (providing low impedance grounding, used in conjunction with internal barrier I/O modules), etc.
Relays and Safety Systems
Standard rack relay options: independent relay (each monitoring module is equipped with more than one relay module), bus relay (multiple monitoring channels share a single relay), Triple Modular Redundancy (TMR) system (high reliability configuration, triple redundancy function, avoiding single point failure).
Intrinsic safety internal barrier system: suitable for hazardous environments, needs to be used in conjunction with grounding modules, has strict installation restrictions (such as prohibiting the use of bus sensors, requiring isolation of RS-232 connections, etc.), and has characteristics such as dual IS grounding and safe/hazardous area wiring separation.
Initial rack installation
General installation process
Refer to the installation checklist (confirm conditions such as power supply, space, ventilation, grounding, etc.);
Install weatherproof casing (if required);
Install the rack;
Set rack jumpers and switches;
Install external terminal blocks (if necessary);
Install modules;
Connect sensors, relays, and power wiring;
Complete the software configuration for rack installation.
Key installation details
Weather resistant enclosure: Meets NEMA 4 requirements, not compatible with display units; Attention should be paid to temperature derating (due to limited ventilation), panel cut size, conduit fittings (to avoid mixing power and signal wiring), and air purification options (to meet specific pressure and flow requirements).
Rack installation: Ensure ventilation (minimum gap of 50.4mm between top and bottom), support panel installation, rack installation (19 inch EIA cabinet), Bulkhead installation, etc. Different installation types have specific size and fixing requirements.
Intrinsic safety operation: Ensure that the grounding resistance is less than 1 Ω, use 4-10mm ² cables to connect to the factory's IS grounding, and use a single point grounding to avoid loops.
High electromagnetic noise/CE installation: The system rack, EMI shielding, and cables must be thoroughly grounded to shield all wiring out of the metal cabinet. CE installation must comply with EN61000.3.2 standard.
Module installation and removal
Installation steps
Power supply: First install the Power Input Module (PIM), configure single point grounding, connect the power cord (in a non powered state), then install the main module and tighten the screws.
Full height module: First install the I/O module (configuration options, fastening screws, connection wiring), and then install the main module (ensure that the ejectors are in place, inserted along the guide rail, and fastened).
Half height module: First install the half height card guide rail, then install the I/O module and main module, similar to the steps for full height modules.
Remove steps
After power off, loosen the module screws and use ejectors (full height) or screws as handles (half height/power) to pull out the module; The I/O module needs to remove the wiring first, and then loosen the screws to remove it.
Replace module
Main module: Save the configuration before removing the old module, reconfigure and verify after installing the new module.
I/O module: The main module and wiring need to be removed first, replaced, reconnected, and verified.
Maintenance
General maintenance
The internal components of the module cannot be repaired on site, and maintenance mainly involves testing whether the channel is normal and replacing faulty modules (spare parts are required).
Support live plugging and unplugging modules (follow the steps in Chapter 4), the system does not require calibration, but the functionality needs to be verified regularly.
Maintenance interval
The initial interval is 1 year; If the monitoring machine is a critical equipment or the rack is in an extreme temperature, high humidity, or corrosive environment, the interval needs to be shortened; Adjust the interval based on the verification results and ISO 10012-1 after each maintenance.
Order Information
Rack ordering: Specify the size (19 inches/12 inches Mini rack), installation method (panel/rack/Bulkhead installation), institutional certification (CSA-NRTL/C), European compliance (CE), etc. through code.
Windproof shell ordering: optional materials (painted steel/stainless steel), conduit fittings, air purification options, etc., incompatible with display units, Mini rack requires adapter panel.
Grounding module and spare parts: The grounding module needs to occupy one rack slot; Spare parts include TMR/SIM jumpers, blank panels, adapters, etc.
Specification parameters
Dimensions: Detailed length, width, and height data for different installation types (panel/rack/Bulkhead installation, full-size/Mini rack) (such as full-size panel installation rack width 482.6mm, height 265.9mm).
Weight: The weight of different configurations (empty/full load, with internal barriers) (such as a full-size full load panel installation of approximately 31.07kg).
Environmental parameters:
Working temperature: -30 ° C to 65 ° C (0 ° C to 65 ° C with internal barrier); Storage temperature: -40 ° C to 85 ° C.
Humidity: 0% -95% without condensation.
Mechanical performance: 10g impact (11ms); 3g sine vibration (5-100Hz).