ADLINK DLAP-211 Series Fanless Edge AI Platform Specification Manual

ADLINK DLAP-211 Series Fanless Edge AI Platform Specification Manual

Core positioning and core advantages of the product

1. Product Positioning

Ultra compact * * fanless edge AI computing platform * *, fully enclosed passive heat dissipation, suitable for harsh fanless scenarios such as industrial outdoor, production lines, retail cabinets, etc. Pre installed with Ubuntu system, supports AI inference upon unboxing, and supports multiple wireless, storage, and industrial IO extensions.

2. Core Highlights

1. * * Multiple computing power Jetson module optional * *: The computing power span ranges from 472GFLOPS to 100TOPS, covering lightweight recognition to complex multi vision;

2. * * Ultra compact size * *: Standard version 148 × 120 × 52mm, S model with extended IO thickness increased to 64mm; the whole machine is lightweight, with a net weight of only 1.01/1.16kg;

3. * * Wide temperature industrial grade * *: Operating temperature range of -20 ℃~70 ℃ under no-load low power consumption, segmented temperature control for high and low power consumption;

4. * * Rich native industrial IO+expansion slots * *: dual gigabit network CAN、 Multi channel serial port GPIO、 Relay, equipped with mini PCIe/M.2 dual expansion booth as standard;

5. * * Two forms * *: Basic version only includes regular video/Ethernet/USB; **S suffix extension * * additionally introduces a 37 pin D-Sub industrial IO interface;

6. * * Multiple installation methods * *: Standard VESA bracket, optional DIN rail installation;

7. Industrial reliability: Watchdog WDT, anti vibration and shock, ESD protection, CE/FCC industrial electromagnetic certification.

Complete model selection classification

The products are divided into four series based on the Jetson module, with the suffix * * S representing an FM expansion IO board (37 pin multifunctional industrial interface) * *, distinguishing the built-in storage media: the Orin series is equipped with M.2 NVMe solid-state drives; The old Xavier/TX2/Nano series uses onboard eMMC flash memory.

1. Orin's next-generation high computing power series (M.2 NVMe 128GB pre installed system)

|Model | Computing power | Memory | Does it have expandable IO (S)|

|DLAP-211 Orin NX 16GB | 100 TOPS | 16GB | No|

|DLAP-211-Orin NX 8GB | 70 TOPS | 8GB | No|

|DLAP-211 Orin NXS 16GB | 100 TOPS | 16GB | Yes|

|DLAP-211 Orin NXS 8GB | 70 TOPS | 8GB | Yes|

|DLAP-211 Orin Nano 8GB | 40 TOPS | 8GB | No|

|DLAP-211 Orin Nano 4GB | 20 TOPS | 4GB | No|

|DLAP-211 Orin NanoS 8GB | 40 TOPS | 8GB | Yes|

2. Previous generation Xavier NX (onboard 16GB eMMC)

-DLAP-211-JNX (8GB memory, no extended IO), DLAP-211-JNX 16GB, DLAP-211-JNXS (with extended IO), AI computing power 21 TOPS.

3.  TX2 NX（JT2，4GB eMMC，1.33TFLOPS）

DLAP-211-JT2 standard version, without S expansion model.

4. First generation Jetson Nano (4GB eMMC, 472GFLOPS)

DLAP-211 Nano (regular version), DLAP-211 Nano S (with extended IO).

Differences in hardware core configuration

1. Differentiation of Computing Power, CPU, GPU Architecture

1. * * Orin NX * *: Ampere architecture 1024 core GPU+32 tensor core, 8-core A78AE, up to 100TOPS;

2. * * Orin Nano * *: Ampere 512 core GPU+16 tensor core, 6-core A78AE, 20/40 TOPS;

3. Xavier NX: Volta 384 core GPU+48 tensor core, 6-core Carmel, 21TOPS;

4. * * TX2 NX * *: Pascal 256 core GPU, dual core Denver+quad core A57;

5. Jetson Nano: Maxwell 128 core GPU, quad core A57.

2. Differences in Storage Solutions

-Orin full range: onboard M.2 2242 PCIe Gen3 × 4 NVMe 128GB (pre installed with Ubuntu), supporting M.2 NVMe/SATA expansion;

-Xavier/TX2/Nano: Equipped with 16GB eMMC flash memory and an SD card slot for expandable storage.

3. Differentiation of power adapters

-Orin NX 16GB high-end: standard 84W 12V/7A power supply;

-All other models: standard 60W 12V/5A power supply;

-The entire machine is powered by a unified 12V DC input.

Whole machine IO interface (divided into front panel, rear panel, S model exclusive extended IO)

1. Universal front panel (standard across all models)

-Keys: power button, reset button, system recovery button;

-Display: 1-channel locking HDMI;

- USB：4×USB3.0 Type-A；

-Network: 2 Gigabit RJ45 Ethernet (10/100/1000M).

2. Universal rear panel (standard across all models)

- USB：1×USB2.0 OTG Micro USB；

-Serial port: 1 multi-functional COM, hardware supports RS232/422/485;

-Bus: 1 CAN 2.0B (excluding TX2 Nano without CAN);

-Antenna: 4 SMA RF interfaces for use with 4G/WiFi modules.

3. Exclusive 37 pin D-Sub industrial IO for S suffix models (with FM expansion board only)

Lead out through the rear 37 pin connector: 2 I2C, 2 SPI, 1 UART, 8 GPIO, and 1 relay output.

4. Built in expansion slot (universal for all models)

1. Mini PCIe card slot: capable of carrying 4G LTE and WiFi wireless modules;

2. M.2 B-key 2242 slot: Expand NVMe solid-state drive.

Mechanical structure, installation, and weight

1. * * Size**

-Standard version (without extended IO): 148mm (W) × 120mm (D) × 52mm (H)

-S Extended Edition (with 37 pin IO): 148mm × 120mm × 64mm

2. * * Weight**

-Standard version: Net weight 1.01kg, gross weight 1.7kg

-S Extended Version: Net weight 1.16kg, gross weight 1.85kg

3. Installation method: standard VESA fixed bracket; Optional DIN rail installation kit;

4. Heat dissipation: The whole machine has no fan and purely passive heat dissipation, relying on the body shell for heat dissipation.

Environmental reliability specifications

1. Working temperature (dependent on overall power consumption and 0.6m/s airflow)

-10W low load: -20 ℃~70 ℃

-15W medium load: -20 ℃~60 ℃

-25W high load: -20 ℃~50 ℃

-Full power consumption limit: only supports -20 ℃~40 ℃, industrial wide temperature devices are required for wireless mPCIe modules

2. Temperature, Humidity, and Storage

-Working humidity: 5%~95% @ 40 ℃, no condensation;

-Storage temperature: -40 ℃~85 ℃.

3. Anti vibration, impact, static electricity

-Vibration: Working state 5Grms, 5~500Hz three-axis (equipped with M.2 SSD);

-Impact: Working state 100G, 11ms half sine pulse;

-ESD protection: Contact discharge ± 4kV, air discharge ± 8kV.

4. Compliance certification

CE, FCC Class B, compliant with industrial electromagnetic standard EN61000-6-4/-6-2; CE-LVD, UL CB certification, with FCC ID;

5. Firmware Function

Onboard hardware watchdog WDT, supports software timeout reset system.

Standard packing list

Each DLAP-211 machine comes standard with:

1. DLAP-211 host;

2. Equipped with 12V industrial power adapter (84W/60W models);

3. Various fixed screw kits for M2.5 and M4;

4. VESA wall bracket;

5. Technical service card, China Europe dual version RoHS compliance declaration.

Optional extension accessories

1. * * Wireless Communication Kit**

-Two sets of WiFi modules: M2-R8852BE (Orin series only), M2-AC9260 universal across the entire series, paired with mPCIe adapter card;

-4G LTE EG25-G module (only available for non Orin models);

2. * * Installation accessories * *: DIN rail fixing kit;

3. * * Storage Expansion * *: 128G/256G/512G/1TB M.2 NVMe, SATA Solid State Drives.

Applicable industry scenarios

Smart city video analysis, intelligent retail visual recognition, industrial production line defect detection, equipment edge prediction and maintenance, traffic roadside AI recognition, warehousing machine vision and other unmanned, low-noise, wide temperature industrial scenarios.