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ADLINK ETX-BT (PATA to SATA version) User Manual

From: | Author:Wang | Time :2026-07-23 | 97 visit: | 🔊 Click to read aloud ❚❚ | Share:

ADLINK ETX-BT (PATA to SATA version) User Manual

Product Overview

1. Product positioning

The standard ETX 3.02 size industrial embedded core module, measuring 114mm × 95mm, is compatible with old ETX carrier boards and belongs to the Bay Trail low-power platform. It supports single core to quad core multi Atom/Celeron processors, balancing traditional ISA/PCI legacy interfaces with modern SATA, gigabit network, and multi display outputs. It supports wide temperature reinforcement selection and is designed for industrial control, automotive, medical, and military embedded scenarios.

2. Core advantages

Compatible with old ETX carrier boards, retaining traditional industrial interfaces such as ISA and dual PATA IDE;

Flexible storage: Native SATA, supports PATA IDE through bridging, optional onboard 2-64GB SATA SSD;

Multi display output: VGA+single/dual channel LVDS+onboard DisplayPort, dual screen independent output;

Integrated SEMA intelligent BMC management unit, hardware level monitoring, watchdog, dual fault safety BIOS;

Wide temperature reinforcement, meeting military grade vibration impact and HALT acceleration life testing requirements.


Complete Hardware Specifications 

2.1 CPU Selection (Multi Specification Bay Trail SoC)

Covering single core to quad core, with a power consumption of 4W~10W:

Atom E3815: Single core 1.46GHz, 5W (corresponding to the basic model in this manual);

E3825/E3826/E3827: dual core 6-8W; E3845: quad core 10W;

Celeron N2807/N2930/J1900 quad core low-power solution;

Unified support for VT-x virtualization SSE4、Intel 64、 Hardware DRNG random number and temperature monitoring; E3805 does not have an integrated graphics card.

2.2 Memory and BIOS

Memory: Single SODIMM slot, maximum 8GB DDR3L 1066/1333 low voltage memory, non ECC;

BIOS: 8MB SPI dual backup BIOS (SPI0/SPI1 fail safe mechanism), AMI EFI architecture, with CMOS power-off backup.

2.3 Expansion Bus

PCI:32bit 33MHz Rev2.3, 4 bus master devices, SW4 DIP adjustable PCI interrupt routing; SW3 switches PCI 3.3V/5V levels;

ISA: Extended through LPC-ISA bridge, without DMA channel, compatible with traditional industrial ISA acquisition cards;

System bus: SMBus, user configurable multi rate I2C bus.

2.4 Graphic display (Gen7 7th generation nuclear display, except E3805)

Rendering capability: 8Gflops of computing power, 4x anti aliasing, DX11、OpenGL3.0、OpenCL1.1、OGLES2.0;

Hard encoding and decoding: H.264/PEG2/VC1/MJPEG hard decoding, H.264/PEG2 hard encoding;

Three independent displays:

VGA: up to 2560 × 1600 24bit;

LVDS: Single/dual channel 18/24 bit, onboard PTN3460 eDP to LVDS chip, hardware backlight PWM adjustment;

DP: Onboard 22Pin flat DP interface, capable of jumper switching DP/HDMI signals.

2.5 Audio

Intel HD Audio architecture, Realtek ALC262 4-channel codec, audio signal is led out from X1 connector.

2.6 Ethernet

Standard 10/100Mbps (X4 connector); Customized onboard FPC with gigabit ports I210/I211, only one network port can be enabled simultaneously, supporting WOL network wake-up (S3/S4/S5).

2.7 I/O and Storage (PATA to SATA Core Design)

Serial port: 2-channel full handshake RS232 (COM1/COM2), supporting IrDA infrared;

Parallel LPT: SPP/EPP mode, without DMA;

PS/2 keyboard mouse;

USB: 4-channel USB 2.0;

Storage architecture (optional customization):

Solution 1: 1 way PATA IDE (main drive)+1 way external SATA;

Option 2: Dual PATA IDE; Option 3: Dual external SATA; Option 4: 1-way PATA+onboard soldered SSD (2-64GB);

PATA achieves compatibility through SATA to PATA bridge chip and only supports UDMA2 transmission rate.

2.8 Super I/O(Nuvoton W83627DHG-PT)

Manage serial and parallel ports PS/2、 Infrared, no floppy drive support (no DMA).

2.9 SEMA Intelligent BMC Controller (Core Industrial Control Management Unit)

Onboard uPD78F0763 microcontroller, running independently of the CPU, core functions:

Power control: AT/ATX mode switching, emergency shutdown, deep ECO S5 ultra-low power consumption;

Hardware monitoring: Real time collection of multi-channel voltage, main current, CPU/board temperature, recording the highest/lowest temperature;

Fault log: total running time, power on times, startup times, restart reasons (power failure/watchdog/BIOS damage);

Reliability: Type-II hardware watchdog, dual fail safe BIOS, 1KB user flash memory+128 byte encrypted protected area;

Peripheral control: LVDS backlight switch, intelligent fan speed regulation, I2C bus management;

Error mechanism: Blue status LED flashing fault code, hardware register recording abnormal.

2.10 Power Supply Specification

Input: Standard ATX (5V/5Vsb) or AT pure 5V;

ACPI4.0, Support energy-saving of C0-C6 processors and sleep of S0/S3/S4/S5; USB wake-up, LAN wake-up;

2.11 Environment and Reliability (Industrial Reinforcement)

Temperature: Standard version 0~+60 ℃; ETT Ultra Wide Temperature Screening Version -40~+85 ℃;

Humidity: Working at 5-90% without condensation; Equipped with a three proof coating, it can store/operate at 5-95% capacity;

Mechanics: Complies with IEC 60068 and MIL-STD-202 military impact vibration standards; Complete HALT temperature vibration and thermal shock composite testing;

MTBF: 79548 hours at 85 ℃ and 278025 hours at room temperature at 40 ℃.

2.12 Operating System Support

Standard: Win7/8.1/10 32/64, Linux 32/64;

Embedded BSP extensions: WES7/8, WEC7/8, VxWorks, QNX real-time systems.


Hardware Function Block Diagram 

Using Intel E3800 SoC as the core, each bus is divided into peripherals:

PCIe channel: Gigabit Ethernet card, PCI to PCI bridge extension standard PCI;

LPC bus: ISA bridge, Super I/O serial parallel port SEMA BMC;

Display path: SoC eDP → PTN3460 to LVDS, while outputting VGA and onboard DP;

Storage path: SATA bridged PATA IDE, optional onboard SSD;

Management link: SEMA reads voltage and temperature through I2C/SMBus, controls backlight/fan/dual BIOS;

Peripherals: 4 USB ports, HD Audio, 4 serial ports, 8 GPIO ports, PS/2 all connected to LPC/PCIe.


Mechanical Dimensions 

ETX standard 114mm × 95mm board type, with a side thickness of approximately 5.25mm; drawing tolerance ± 0.05mm (key dimension), others ± 0.2mm; connector, dial, and fan seat positions are marked on the front and back respectively.

Definition of pins for the four major ETX standard connectors 

Four 100 pin standard ETX sockets X1/X2/X3/X4 on the side of the module, complete list of each pin's signal, level, pull-up and pull-down resistors, and functional description:

X1(PCI+USB+HD Audio)

32-bit full PCI address/data/interrupt, 4-channel USB 2.0 differential, audio input/output, 3.3V/5V onboard power supply; Support PCI interrupt DIP switching.

X2 (ISA 16 bit bus)

Complete ISA address/data, IRQ interrupt, DMA request response, refresh, IO read/write signals, compatible with traditional ISA cards.

X3 (VGA+LVDS+serial port+parallel port+PS2)

VGA RGB line field synchronization, dual channel LVDS 24 bit differential, backlight PWM/enable, COM1/COM2 full handshake serial port, LPT parallel port, PS2 keyboard and mouse, I2C screen control bus.

X4 (PATA IDE+Gigabit Ethernet+System Control)

Main/secondary PATA IDE data cable, gigabit differential transceiver, power button, buzzer, reset, LED link/speed indicator light, SMBus/I2C monitoring bus, battery low level detection.


Onboard non-standard connectors, dip switches, indicator lights 

6.1 Dial switch (hardware configuration core)

SW1 (back): SPI dual BIOS boot selection, default SPI0 main+SPI1 fault backup, can force single BIOS boot;

SW2: CMOS BIOS default reset button, long press to restore factory settings upon startup;

SW3 (back): PCI bus level, default 3.3V, can switch 5V;

SW4: PCI four group interrupt routing ABCD four allocation schemes, adapted to real-time operating system requirements.

6.2 Onboard external socket

DB40 40Pin multifunctional debugging port: SPI BIOS burning, BMC debugging, LPC bus, power test point, POST fault code output, used in conjunction with DB40 debugging module;

XDP 26Pin JTAG Debugging Head: Intel platform hardware debugging, compatible with ITP-XDP3 emulator;

DP 22Pin flat interface: outputs 4-lane DisplayPort, switches DP/HDMI levels with jumper wires on the carrier board;

4Pin fan socket: PWM speed regulation+speed detection, 5V power supply;

20Pin FPC Gigabit Ethernet Port (Customized Version): Only compatible with non-standard models, standard Ethernet port uses X4;

6.3 Tri color Status LED

LED1 (blue): BMC fault indicator light, flashing corresponding fault codes when abnormal (overvoltage, overheating, BIOS damage, power failure, etc.);

LED2 (green): The power status of the entire machine, S0 is constantly on, S3/S4/S5 is off; Turn off when the watchdog counts, and turn on after hardware restart;

LED3: Reserve watchdog status indication.


SEMA Embedded Management Controller Detailed Explanation 

7.1 Hardware monitoring capability

Voltage acquisition: CPU core, GPU core, memory, 1.05V, 3.3V, overall input voltage, built-in ADC conversion formula;

Current acquisition: Input current of the whole machine, sampling 4 sets of historical data every 250ms;

Temperature: Onboard LM73 dual temperature sensor, real-time storage of highest and lowest temperatures;

7.2 Status and Exception Mechanism

BMC status register: watchdog output, LVDS power/backlight enable, BIOS select bit;

Fault exception codes: 0 no fault, 2 no standby clock, 6 BIOS startup failure, 8 power failure, 18 critical high temperature and other 21 types of hardware faults, power off and clear;

BMC flag: records the current AT/ATX mode, use of main/fault BIOS, and the latest fault code;

7.3 Storage and Statistics

Independent flash storage of the entire machine lifecycle data: total running minutes, single boot duration, power on times, boot times, last restart reason, not lost during power failure.


System Resource Allocation

Memory mapping: BIOS low zone 000E0000~000FFFF, high-end 64KB BIOS, APIC/HPET high-end IO address;

I/O address mapping: 8259 interrupt controller RTC、 Serial port COM1/COM2, parallel port, SMBus, GPIO fixed IO base address;

IRQ interrupt allocation: divided into PIC traditional mode and APIC advanced mode, distinguishing between onboard device fixed interrupts and reusable PCI interrupts;

PCI bus device mapping: SoC core display SATA、USB、 Complete device numbers for audio, gigabit network card, and PCI bridge;

PCI interrupt routing table: APIC interrupt numbers corresponding to core graphics, PCIe ports, storage, network cards, and audio;

SMBus/I2C device address: DDR memory, LVDS conversion chip Super I/O、BMC、 The temperature sensor has a fixed bus address.


BIOS Complete Setup Menu 

AMI EFI six tiered menu, detailed description of all configurable items:

Main menu: BIOS version, CPU/memory/graphics card information, SEMA machine lifecycle statistics (temperature, power consumption, runtime, power on times), system time;

Advanced Settings (Core Configuration)

CPU: virtualization VT-x, EIST energy-saving, temperature control, CPUID restriction;

Memory: SPD write protection, memory addressing limit;

Graphics: Main display output, LVDS resolution/color depth, backlight brightness, RC6 graphics card energy-saving;

SATA: AHCI/IDE mode, hot swappable, speed Gen1/Gen2;

USB: Compatibility mode, XHCI/EHCI handover, timeout parameter;

Network, PCI bus, Super IO serial port parallel port mode;

ACPI power supply, HD audio, serial console redirection, temperature threshold, miscellaneous SSC spread spectrum clock, secure TPM;

Security: administrator/user passwords, secure boot key management;

Boot boot: boot sequence, CSM compatibility module, UEFI/traditional boot filtering, fast boot;

Save&Exit: Save/discard modifications, factory reset, EFI Shell startup.


Safety regulations and after-sales service (Safety, Getting Service)

Safety operation regulations: Disassembly and assembly with power off, keep away from high temperatures of liquids, ensure ventilation, prohibit self disassembly and maintenance, and power off for long-term use;

Global service outlets: Shanghai in mainland China, Taoyuan in Taiwan, California in the United States, Mannheim in Germany, providing telephone and email technical support, and official RMA repair channels.

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