ADLINK ETX-NR667 Embedded ETX Standard Computer Module

ADLINK ETX-NR667 Embedded ETX Standard Computer Module

Basic and Product Positioning

1. Basic information

ADLINK ETX-NR667 Embedded ETX Standard Computer Module Datasheet, using ETX Rev3.02 industrial standard size (95mm × 114mm), is the first generation Core Dual Core ETX module based on Intel 945GME+ICH7-M mobile chipset. It is compatible with both old and new ETX carrier boards, with optional high and low power CPUs, and supports PATA+SATA dual storage, multiple display outputs, and retains ISA traditional industrial bus. It is suitable for medical equipment, industrial automation POS、 Vehicle mounted, testing and measurement, game console and other scenarios.

2. Core Highlights

CPU coverage includes ultra-low power Celeron M, Yonah Core dual core, Merom Core 2 dual core, with a power consumption range of 5.5W~17W, and can be adapted to both fanless and cooling solutions;

Native dual SATA interface, while retaining the traditional dual PATA IDE, the old ETX carrier board can use SATA devices without modification;

GMA950 integrated graphics card, supporting VGA, single/dual channel LVDS, TV-OUT three-way independent display;

Simultaneously retaining 32-bit PCI+16 bit ISA dual expansion bus, compatible with old-fashioned industrial acquisition cards;

Integrated hardware monitoring, programmable watchdog, CMOS backup, and complete industrial I/O.

Core hardware specifications

2.1 CPU Selection (Micro FCBGA Package, 4 Standard Models)

Model Core/Main Frequency L2 Cache Typical Power Consumption Architecture

Celeron M 423 Single Core 1.06GHz 1MB 5.5W ULV Ultra Low Power Yonah

Core Duo U2500 Dual Core 1.2GHz 2MB 9W ULV Yonah

Core Duo L2400 Dual Core 1.66GHz 2MB 15W Low Power Yonah

Core2 Duo U7500 Dual Core 1.06GHz 2MB 10W Merom 64 bit

Core2 Duo L7400 Dual Core 1.5GHz 4MB 17W Merom 64 bit

Unified support for EIST energy-saving, VT virtualization, and EM64T 64 bit (Core2 series).

2.2 Chipset and Memory

North Bridge: Intel 945GME, integrated with GMA950 display core;

Nanqiao: ICH7-M Mobile Edition;

Memory: Single SO-DIMM slot, maximum 2GB DDR2 533/667MHz, non ECC;

BIOS：AMI 8 BIOS， Equipped with CMOS power-off backup.

2.3 Expansion Bus

32bit PCI 2.3 @33MHz， Support multi bus master control;

16 bit ISA bus (IT8888 bridge), compatible with traditional industrial ISA peripherals;

SMBus/I2C system management bus.

2.4 Graphic display system (three independent outputs)

VGA CRT: maximum resolution of 2048 × 1536;

LVDS: Single/dual channel 18/24 bit LCD screen output;

TV-OUT: Supports NTSC/PAL, compatible with 480p/720p/1080i/1080p high-definition output (without Macrovision encryption);

Features: Dual screen independent display, hardware 2D acceleration.

2.5 Audio

ICH7-M integrated audio controller, paired with Realtek ALC268 HD Audio codec.

2.6 Ethernet

PCIe x1 Realtek RTL8111C, 10/100Mbps adaptive network port.

2.7 Storage Interface (PATA+SATA coexistence, core advantages)

PATA IDE: Dual channel UDMA33, supports old IDE hard drives/optical drives;

SATA: 2-channel standard SATA interface, native export, old ETX carrier board can use SATA solid state drive without modification;

The bridge chip JML368 enables PATA to communicate with the chipset.

2.8 Multi I/O Peripherals (Super I/O W83627HG)

USB 2.0:4 channel;

Serial port: 2-channel high-speed RS232 (COM1/COM2), supporting SIR IrDA infrared;

Parallel port: LPT, supports SPP/EPP/ECP, pin and floppy drive multiplexing;

Soft drive: 1 way;

Input: PS/2 keyboard+PS/2 mouse.

2.9 Hardware management function

Hardware monitoring: onboard voltage acquisition, CPU temperature monitoring;

Programmable watchdog timer, automatically resets the entire machine upon timeout;

CMOS data backup, power off without losing BIOS configuration.

2.10 Power Supply Specification

Power supply mode: AT (only 5V), ATX (5V+5Vsb standby) dual-mode;

Power status: S0/S1/S3/S4/S5 in full ACPI sleep mode;

Typical power consumption: Equipped with U7500+1GB memory, only 18W.

Mechanical and Environmental Reliability

Appearance: ETX Rev3.02, 95mm × 114mm;

Working temperature: 0 ℃~+60 ℃; Storage -20 ℃~+80 ℃;

Humidity: 5%~95% RH without condensation;

Impact (non working): 15G, 11ms;

Vibration:

Non operational: 1.88Grms 5~500Hz three-axis;

Operation: 0.5Grms 5~500Hz three-axis;

Certification: CE, FCC.

Operating system support

Standard Universal System

Windows Vista 32/64、Windows XP 32/64、Linux 2.6.x。

Embedded custom BSP

Embedded XP, Windows CE 6.0, Linux custom kernel; Supporting AIDI underlying libraries (Win32/WinCE/Linux).

Hardware functional block diagram logic

Using CPU as the computing core, 945GME Northbridge is responsible for memory, graphics, and PCIe channels; ICH7-M South Bridge coordinates all low-speed peripherals:

Display branch: Northbridge outputs VGA, LVDS, TV-OUT three video channels to X4 connector;

Storage branch: Southbridge leads out dual SATA; Bridge dual PATA IDE through JML368;

Expansion bus: LPC bus connected to Super I/O (serial/parallel/keyboard and mouse); PCIe Ethernet port; IT8888 bridge splits ISA/PCI bus to X2;

Audio/USB: Southbridge HD audio, 4-channel USB output via X1;

Peripherals: keyboard and mouse, serial port, parallel port, infrared all output from X3 connector;

Management: SPI BIOS, hardware monitoring, and debugging head are connected to the South Bridge LPC bus.

Model and matching heat dissipation accessories

1. Motherboard ordering model

ETX-NR667-L7400：Core2 Duo L7400 1.5GHz；

ETX-NR667-L2400：Core Duo L2400 1.66GHz；

ETX-NR667-U7500：Core2 Duo U7500 1.06GHz；

ETX-NR667-423：Celeron M 423 1.06GHz。

2. Heat dissipation options

HTS-NR667-B: Non threaded heat dissipation gasket;

THS-NR667-B: Short passive heat sink;

THSF-NR667-B: High performance active heat sink with fan.