SNAP PAC System Specification Guide

SNAP PAC System Specification Guide

1. System Overview

The SNAP PAC System is an integrated industrial PAC control system launched by Opto 22, used for automatic control, remote monitoring, and data acquisition.

Published in 2007, Document Version: January 2026

Core components: software suite+controller+I/O module+network

Important note: Starting from 2022, some core components will be discontinued. It is recommended to replace them with Groov EPIC to maintain full compatibility.

2. Software System (PAC Project)

Version cost, core functions, advanced capabilities

Basic free flowchart programming, basic HMI, configuration tools are not available

Professional payment for all Basic functions, OPC server, database integration, network redundancy, and old system migration

Core software:

PAC Control: Process Diagram Control Programming

PAC Display: HMI Interface Development

PAC Manager: Hardware Configuration and Diagnosis

SoftPAC: PC software controller

3. Controller hardware

Divided into independent S series, rack mounted R series, and software based SoftPAC.

S series (S1/S2)

Independent installation, dual independent Ethernet ports

S1: 3 serial ports (RS232+RS485)

S2: 4 configurable serial ports

Support redundant networks and outdated Mistic I/O

R series (R1/R2)

Rack installation, integrated I/O processor

Dual Ethernet ports, supporting high-speed digital functions

Replace discontinued EB brain with distributed I/O

SoftPAC

Running in Windows environment, only Ethernet communication

Large storage, high computing power, suitable for math intensive applications

4. I/O module system (core specifications)

(1) Digital I/O

Channel: 4/16/32 channels, high-density design

Type: AC/DC input, solid-state/mechanical relay output

Key parameters:

Isolation: Optocoupler 4000V transient, channel to channel 1500V

Voltage: 5~280V AC/DC

Current: Module maximum 3A

Warranty: Most products come with a lifetime warranty, while mechanical relays have a 30 month warranty

(2) Simulate I/O

Input: current (4~20mA), voltage RTD、 Thermocouple, weighing, frequency

Output: Current (4~20mA), voltage, time proportional output

Key parameters:

Resolution: Input ≈ 15 bits, output 12 bits

Isolation: Transformer isolation 1500V

Temperature sensing range: -200~850 ℃

(3) Serial communication module

Type: RS232, RS485/422, CAN, stepper control

Baud rate: 300~115200bps

Maximum per rack: 8 serial port modules

Warranty: 30 months

5. Network solution

Dual Ethernet interface

Independent dual network ports: achieve redundant links and network segment isolation

Not supporting daisy chain (different from discontinued EB brain)

Supported Protocols

Modbus/TCP, EtherNet/IP (compatible with AB PLC)

REST API、MQTT（IIoT）

Serial port network

RS485 connection to old version SB brain, mistic I/O

6. Installation and wiring

Rack specifications: 4/8/12/16 slots, mixed installation of various I/O types

Power system:

Main power supply: 5VDC, maximum 4~5A

Circuit power supply: 24VDC, used for analog excitation

Wiring specifications:

Wire gauge: 22~14AWG

Torque: Fixed screw ≤ 1 in lb, terminal ≤ 5.22 in lb

Accessories: SNAP TEX prefabricated cables, breakout board simplified wiring

7. Environment and Certification

Working temperature: -20~70 ℃

Storage temperature: -40~85 ℃

Humidity: 5~95% without condensation

Certification: UL, CE, CSA, RoHS, UKCA, ATEX