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GE FANUC Mark* VIe Control

Telephone:+86-15305925923

contacts:Mr.Wang

Email:wang@kongjiangauto.com

This document is distributed for informational purposes only.

It is not to be construed as creating or becoming part of any

General Electric Company contractual or warranty obligation

unless expressly stated in a written sales contract.

List price：￥22000.00

Price：￥22000.00

MemberPrice：

Weight：3.500KG

Quantity：

(Inventory: 20)

Consultation

Product parameters

Telephone:+86-15305925923
contacts:Mr.Wang
Email:wang@kongjiangauto.com

Description

This document is distributed for informational purposes only.

It is not to be construed as creating or becoming part of any

General Electric Company contractual or warranty obligation

unless expressly stated in a written sales contract.

GE FANUC Mark* VIe Control

Mark* VIe is a flexible control system for multiple applications. It features high speed, networked I/O for simplex, dual, and triple redundant systems. Industry standard Ethernet
communications are used for I/O, controllers, and supervisory

interface to operator and maintenance stations, and third-party systems.

ToolboxST* is used for Mark VIe and related controls as a common software

platform for programming, configuring I/O, trending, and analyzing diagnostics. It

provides a single source of quality, time-coherent data at the controller and plant

level for effectively managing equipment assets.
A single-board controller is the heart of the system. It includes the main processor

and redundant Ethernet drivers for communicating with networked I/O and

additional Ethernet drivers for the control network. A QNX® real-time, multitasking

operating system is used for the main processor and I/O. Application software is

provided in a configurable control block language, and is stored in non-volatile

memory. It conforms to IEEE-854 32-bit floating-point format.

IONet is a dedicated, full-duplex, point-to-point protocol that provides a

deterministic, high-speed 100 MB communications network suitable for local or

remote I/O with a fiber interface. It provides communication between the main

processor(s) and networked I/O blocks, called I/O packs.

100 MB Ethernet is used for

communication to local and

remote I/O packs. The IONet

is available in single, dual,

and triple configurations.

Each I/O pack is mounted on a board with barrier or box-type terminal blocks. The

I/O pack contains two Ethernet ports, a power supply, a local processor, and a data

acquisition board. Computation power grows as I/O packs are added to the control

system, enabling an overall control system frame rate of 10 ms in simplex, dual, or

triple redundant configuration. Some process sub-systems require even more

performance; therefore, the local processors in each I/O pack run algorithms at

higher rates as required for the application.

Redundancy

Every application has different requirements for redundancy depending on the

importance of the process. Mark VIe provides a wide range of redundancy options

that can be supplied in virtually any combination and mounted local or remote. Some

of these redundancy options include:

• Power sources and supplies single, dual, and triple

• Controllers (main processor) single, dual, and triple

• I/O network redundancy single, dual, and triple

• I/O packs per terminal board single, dual, and triple

• Ethernet Ports / I/O pack single or dual

Controllers are continuously online and read input data directly from IONet. Dual

redundant systems transmit inputs from one or redundant I/O packs on dual IONets

to dual controllers. Outputs are transmitted to an output I/O pack that selects either

the first healthy signal or the signal of choice. Three output packs can be provided to

vote output signals for mission-critical field devices.

Dual redundant systems can be configured for single, dual, and triple sensors. Their

dual internal networks and controllers keep the process online if a controller or

power supply fails. Triple redundant systems are available to protect against soft or

partial failures of devices that continue to run but with incorrect signals/data.

These systems out vote a failed component with a 2-out-of-3 selection of the signal.

Application software in all three controllers runs on the voted value of the signal

while diagnostics identify the failed device. These sophisticated diagnostics

minimize the mean-time-to-repair (MTTR) while the on-line repair capability

maximizes the mean-time-between-forced-outages (MTBFO). Field sensors for these

systems can be single, dual, or triple.

A second controller can be provided to separate the application software for different

pieces of equipment. For example, a core engine control for an air-fuel governor can

run in one controller while a second controller can be dedicated to auxiliary control.

Note Every I/O pack communicates directly on IONet, which enables each I/O pack

to be replaced individually without affecting any other I/O in the system. Also, the

I/O pack can be replaced without disconnecting any field wiring.

I/O Interface

One or multiple I/O packs are mounted on each board to digitize the sensor signal,

perform algorithms, and communicate with a separate controller that contains the

main processor. I/O packs have a local processor board that runs a QNX operating

system and a data acquisition board that is unique to the type of input device. Local

processors run algorithms at faster speeds than the overall control system.

An on-board temperature sensor

provides continuous monitoring of

the environment in remote

locations.

An infrared transceiver is useful for low-level diagnostics. I/O values can be

monitored, I/O pack host/function names can be programmed, and error statuses can

be checked. This requires a Windows®-based diagnostic tool on a laptop or a

handheld computer.

• Dual 100 MB Ethernet ports

• 100 MB full duplex ports

• Online repair per I/O pack

• Operation -30°C to 65°C (-22 °F to 149 °F)

• Accuracy -30°C to 65°C (-22 °F to 149 °F)

• I/O packs rated Class 1, Div. 2

• Ambient temperature sensor

• LEDs: power status and attention

• LEDs: Ethernet link-connected and communication-active

• LEDs: application-specific

• Processor: 32-bit RISC CPU 266 mHz

• Infrared Transceiver: Low level diagnostics, monitor I/O,

set host/function names, error status

• Power: 28 V dc (typical)

• Internal solid-state circuit breaker and soft start

The I/O Processor contains a temperature sensor that is accurate to within ±2°C

(±3.6 °F). Detection of an excessive temperature generates a diagnostic alarm, and

the logic is available in the database (signal space) to facilitate additional control

action or unique process alarm messages. In addition, the temperature is

continuously available in the database.

A power supply provides a regulated 28 V dc power feed to each I/O pack. The

negative side of the 28 V dc is grounded through the I/O pack metal enclosure and its

mounting base. The positive side has solid-state circuit protection built-into the I/O

pack with a nominal 2 A trip point. Online repair is possible by removing the

28 V dc connector, replacing the I/O pack, reinserting the power connector, and

downloading software from the software maintenance tools.

Note Every I/O pack communicates directly on IONet, which enables each I/O pack

to be replaced individually without affecting any other I/O in the system. Also, the

I/O pack can be replaced without disconnecting any field wiring.

Terminal Blocks

Signal flow begins with a sensor connected to a terminal block on a board. There are

two types of boards available. T-type boards contain two 24 point, barrier-type,

removable, terminal blocks. Each point can accept two 3.0 mm2

(#12AWG) wires

with 300 V insulation per point with spade or ring type lugs. In addition, captive

clamps are provided for terminating bare wires. Screw spacing is 9.53 mm (0.375

inch) minimum, center-to-center.

A shield strip is provided next to each block, which is actually the left-hand side of

the metal base where the board is mounted. Wide and narrow boards are arranged in

vertical columns of high and low-level wiring that can be accessed from top and/or

bottom cable entrances. An example of a wide board is a board that contains

magnetic relays with fused circuits for solenoid drivers. T-type boards are normally

surface mounted, but can also be DIN-rail mounted.

Barrier and Box Type Boards with I/O Packs

S-type boards have one I/O pack for simplex and dual redundant systems. They are

half the size of T-type boards and are DIN-rail or surface mounted. Two versions of

the boards are available, H1 and H3. H1 boards have fixed terminal blocks, and H3

boards have removable terminal blocks. A H2 version is available for mounting of

custom blocks such as spring-cage or insulation displacement.

S-type boards have box type terminal blocks that accept one 3.0 mm2

(#12AWG)

wire or two 2.0 mm2

(#14AWG) wires with 300 V insulation per point. Screw

spacing is 5.08 mm (0.2 inch) minimum, center-to-center. A shield strip is provided

to the left of each block. It can be connected to a metal base for immediate grounding

or floated to allow individual ground wires from each board to be wired to a

centralized, cabinet ground strip.

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