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MOTOROLA MVME147 MPU VMEmodule
MOTOROLA MVME147 MPU VMEmodule
DESCRIPTION
The MVME147 is a double-high VMEmodule based on the MC68030 microprocessor. It is best utilized in a 32-bit VMEbus system with both P1 and P2 backplanes. The module has high functionality with large onboard shared RAM, serial ports, and Centronics printer port. The module provides a SCSI bus controller with DMA, floating-point coprocessor, tick timer, watchdog timer, and time-of-day clock/calendar with battery backup, 4KB of static RAM with battery backup, four ROM sockets, and A32/D32 VMEbus interface with system controller functions.
The MVME147 can be operated as part of a VMEbus system with other VMEmodules such as RAM modules, CPU modules, graphics modules, and analog I/O modules. The following transition boards are compatible with the MVME147:
❏ MVME712-12
❏ MVME712-13
❏ MVME712A
❏ MVME712AM
❏ MVME712B
Equipment Required
The following equipment is required to make a complete system using the MVME147:
❏ Terminal
❏ Disk drives and controllers
❏ Transition module(s) and connecting cables:
– MVME712-12
– MVME712-13
– MVME712A
– MVME712AM
– MVME712B
– MVME712M
The MVME147Bug debug monitor firmware (147Bug) is provided in the two EPROMs in sockets on the MVME147. It provides:
❏ Over 50 debug, up/downline load, and disk bootstrap load commands
❏ Full set of onboard diagnostics
❏ One-line assembler/disassembler
Cooling Requirements
Motorola VMEmodules are specified, designed, and tested to operate reliably with an incoming air temperature range from 0 degrees C to 55 degrees C (32 degrees F to 131 degrees F) with forced air cooling. Temperature qualification is performed in a standard Motorola VMEsystem- 1000 chassis. Twenty-five watt load boards are inserted in the two card slots, one on each side, adjacent to the board under test to simulate a high power density system configuration. An assembly of three axial fans, rated at 100 CFM per fan, is placed directly under the MVME card cage. The incoming air temperature is measured between the fan assembly and the card cage where the incoming airstream first encounters the module under test. Test software is executed as the module is subjected to ambient temperature variations. Case temperatures of critical, high power density integrated circuits are monitored to ensure component vendors specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the ambient air temperature and the type, number, and location of boards and other heat sources, adequate cooling can usually be achieved with 10 CFM flowing over the module. Less air flow is required to cool the module in environments having lower maximum ambients. Under more favorable thermal conditions it may be possible to operate the module reliably at higher than 55 degrees C with increased air flow. It is important to note that there are several factors, in addition to the rated CFM of the air mover, which determine the actual volume of air flowing over a module.
Specifications
Storage temperature：-40˚ to 85˚ C
Relative humidity：-5% to 90% (non-condensing)
Height：9.187 inches (233.35 mm)
Depth：6.299 inches (160.0 mm)
Thickness：0.063 inches (1.6 mm)
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