GE EMERSON PACSystems RX3i I/O
Modular, High-Speed PerformanceRX3i is a rack-based system with a wide range of modules
covering digital, analog, and numerous other specialty
I/O types. These pluggable and hot-swappable modules
allow you to customize the right mix of I/O, with a variety of
voltage ranges and current capacities supported to meet
all your application needs. Regardless of the I/O mix you
choose, RX3i is built on high speed interfaces to provide
rapid and consistent data transfer.
Highly Scalable
With the ability to pair I/O, RX3i allows you to scale your system with ease. In addition to I/O that you can put
on the main rack, you can expand locally or remotely to connect to additional racks of I/O. In fact, RX3i can support as
few as 8 I/O points and up to 32 thousand I/O points in a single system. With 7 to 16 slot backplanes and 1 slot expansion
options, you can create the perfect system to fit your needs.
Perfect Upgrade Path
Emerson PACSystems RX3i gives you a simple migration path and offers a quick and painless upgrade plan from
legacy systems like Series 90-30, 90-70, and RX7i. RX3i allows you to re-use Series 90-30 modules on RX3i backplanes,
so you can upgrade your I/O system without disturbing wires or buying new I/O. Upgrading to RX3i provides improved
communications with integrated Ethernet along with modern USB for serial or memory sticks. With a smaller form factor,
higher capacity, and speeds over 100 times faster than legacy controls, RX3i is an easy and cost effective upgrade to
protect your investment without disruption. Upgrade in hours, not days!

High Availability
Eliminate process interruptions with PACSystems
RX3i I/O. Beyond just the high performance RX3i offers
in simplex configurations, high availability configurations are
also possible for maximum reliability. Both Ethernet Global
Data (EGD) and PROFINET System Redundancy (PNSR) are
supported. With gigabit speed and bumpless switchover,
choosing RX3i high availability will prevent unexpected
failure and costly downtime.
Rugged Connector Terminals
In the RX3i family all I/O modules have removal terminal blocks for easy commissioning and maintenance.
This focus on ease of use is extended with the range of supported wire gauges. Depending on the Terminal block type
chosen, the wire gauge ranges from 0.081mm2
- 1.5mm2
(28 - 14AWG) solid or stranded wire.
Spring style and box style modules are also both available for your preferred connection method. Terminal Block
Quick Connect (TBQC) and positive retention are supported on both low density and high density terminal blocks
to ensure confidence in wiring stability and a consistent commissioning experience.
Specifications
Mounting Format
• Panel Mount
• Rack Mount
Network Interfaces
• PROFINET
• Modbus/TCP
• Ethernet Global Data (EGD)
• Control Memory Exchange (CMX)
• PROFIBUS DP
Gateways / Bridges
• Serial Communications
• Modbus/RTU
• Modbus/TCP
• HART
• GENIUS
• DNP3 Serial/TCP
• IEC-61850
• IEC-104
• Reflective Memory
• PROFIBUS/Master
• CANOpen
Network Redundancy
• Media Redundancy Protocol (MRP)
• Dual LAN
System Redundancy
• PROFINET System Redundancy (PNSR)
• Ethernet Global Data (EGD)
I/O Redundancy
• Via Application Code
Media Support
• Copper
• SM Fiber
• MM Fiber

PACSystems RX3i I/O
Media Connector
• 2x RJ45 and 2x SFP
I/O Types
• Digital
• Voltage
• TL
• Relay
• Analog
• Voltage/Current
• RTD
• Thermocouple
Specialty Modules
• Pulse Test (24, 125 Vdc)
• High Speed Counters
• Pulse With Modulation (PWM)
• Pulse Output
• Power Sync & Measure
• Strain Gauge
• SoE Inputs (application)
Isolation
• Galvanic Isolation
• DI, DO, AI, AO
Hot Swap
• Yes
Environmentals
• IP20
• 0°C to 60°C
• -40°C to 60°C options
• Conformal coat options
Agency Approvals
• UL
• UL HazLoc C1D2
• CE
• ATEX Zone 1
Marine (only select models)
• ABS
• BV
• DNV GL
Channel Density
• 2 - 32 points
Max Wire Gauge
• 12 (low density)
• 14 (high density)
Max I/O per Drop
• 448